Invention Grant
- Patent Title: System and method for extended peripheral component interconnect express fabrics
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Application No.: US16010235Application Date: 2018-06-15
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Publication No.: US10216676B2Publication Date: 2019-02-26
- Inventor: Wesley Shao
- Applicant: Futurewei Technologies, inc.
- Applicant Address: US TX Plano
- Assignee: FutureWei Technologies, Inc.
- Current Assignee: FutureWei Technologies, Inc.
- Current Assignee Address: US TX Plano
- Agency: FutureWei Technologies, Inc.
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/16 ; G06F13/42

Abstract:
An exemplary embodiment extended peripheral component interconnect express (PCIe) device includes a host PCIe fabric comprising a host root complex. The host PCIe fabric has a first set of bus numbers and a first memory mapped input/output (MMIO) space on a host CPU. An extended PCIe fabric includes a root complex endpoint (RCEP) as part of an endpoint of the host PCIe fabric. The extended PCIe fabric has a second set of bus numbers and a second MMIO space separate from the first set of bus numbers and the first MMIO space, respectively.
Public/Granted literature
- US20180300277A1 System and Method for Extended Peripheral Component Interconnect Express Fabrics Public/Granted day:2018-10-18
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