A metal foil for electromagnetic shielding 10, comprising a base 1 consisting of a metal foil, an underlayer 2 including Ni formed on one or both surfaces of the base, and a Sn—Ni alloy layer 3 formed on a surface of the underlayer, wherein the Sn—Ni alloy layer includes 20 to 80 weight % of Sn, and when a total deposition amount of Sn is represented by TSn [μg/dm2], a percentage of Sn in the Sn—Ni alloy is represented by ASn [weight %], a total deposition amount of Ni is represented by TNi [μg/dm2], and a percentage of Ni in the Sn—Ni alloy is represented by ANi [weight %], TSn: 500 to 91000 μg/dm2, TNi: 2200 to 236000 μg/dm2, 170000=>{TNi−TSn×(ANi/ASn)}=>1700.