Invention Grant
- Patent Title: Integrated system and method of making the integrated system
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Application No.: US15618684Application Date: 2017-06-09
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Publication No.: US10224317B2Publication Date: 2019-03-05
- Inventor: Thomas Kilger
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/00 ; H01L23/498 ; H01L23/538 ; H01L25/10 ; H01L23/64 ; H01L23/00 ; H01F27/29 ; H01L21/3205 ; H01L21/78 ; H01L25/065 ; H01F27/28 ; H05K1/16 ; H05K1/18 ; H01L21/56
Abstract:
A system and method of manufacturing a system are disclosed. An embodiment of the system includes a first packaged component comprising a first component and a first redistribution layer (RDL) disposed on a first main surface of the first packaged component, wherein the first RDL includes first pads. The system further includes a second packaged component having a second component disposed at a first main surface of the second packaged component, the first main surface having second pads and a connection layer between the first packaged component and the second packaged component, wherein the connection layer connects a first plurality of the first pads with the second pads.
Public/Granted literature
- US20170278836A1 Integrated System and Method of Making the Integrated System Public/Granted day:2017-09-28
Information query
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