- 专利标题： Integrated system and method of making the integrated system
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申请号： US15618684申请日： 2017-06-09
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公开(公告)号： US10224317B2公开(公告)日： 2019-03-05
- 发明人: Thomas Kilger
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L25/00 ; H01L23/498 ; H01L23/538 ; H01L25/10 ; H01L23/64 ; H01L23/00 ; H01F27/29 ; H01L21/3205 ; H01L21/78 ; H01L25/065 ; H01F27/28 ; H05K1/16 ; H05K1/18 ; H01L21/56
摘要：
A system and method of manufacturing a system are disclosed. An embodiment of the system includes a first packaged component comprising a first component and a first redistribution layer (RDL) disposed on a first main surface of the first packaged component, wherein the first RDL includes first pads. The system further includes a second packaged component having a second component disposed at a first main surface of the second packaged component, the first main surface having second pads and a connection layer between the first packaged component and the second packaged component, wherein the connection layer connects a first plurality of the first pads with the second pads.
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