Invention Grant
- Patent Title: Conductive multilayer sheet for thermal forming applications
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Application No.: US15502312Application Date: 2015-04-20
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Publication No.: US10227465B2Publication Date: 2019-03-12
- Inventor: Wei Feng , Yuzhen Xu , Hengjie Lai , Zhe Chen , Yonglei Xu
- Applicant: SABIC Global Technologies B.V.
- Applicant Address: NL Bergen op Zoom
- Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
- Current Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
- Current Assignee Address: NL Bergen op Zoom
- Agency: Cantor Colburn LLP
- International Application: PCT/IB2015/052886 WO 20150420
- International Announcement: WO2016/020766 WO 20160211
- Main IPC: C08G63/02
- IPC: C08G63/02 ; C08J7/04 ; C08J7/16 ; C08J7/18 ; B29B11/12 ; B29B13/08 ; B29C51/00 ; B29C51/02 ; B29C51/10 ; B32B27/36 ; B29K69/00 ; B29K105/00

Abstract:
A method of making a multilayer sheet includes: forming a substrate including a substrate first surface and a substrate second surface; applying a conductive layer including a base and a conductive coating to the substrate first surface; and applying an ultraviolet cured coating layer to a surface of the conductive layer opposite that in contact with the substrate second surface, wherein the ultraviolet cured coating layer comprises a multifunctional acrylate oligomer and an acrylate monomer; pressing the substrate, conductive layer, and ultraviolet cured coating layer together to form a stack; heating the stack; activating the ultraviolet cured coating layer with an ultraviolet radiation source; and removing the base from the stack leaving a conductive multilayer sheet; wherein the ultraviolet cured coating layer remains adhered to the conductive layer.
Public/Granted literature
- US20170226303A1 CONDUCTIVE MULTILAYER SHEET FOR THERMAL FORMING APPLICATIONS Public/Granted day:2017-08-10
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