Invention Grant
- Patent Title: Multi-layered ceramic capacitor with soft leaded module
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Application No.: US14096605Application Date: 2013-12-04
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Publication No.: US10229785B2Publication Date: 2019-03-12
- Inventor: John E. McConnell , Alan P. Webster , Lonnie G. Jones , Garry L. Renner , Jeffrey W. Bell
- Applicant: Kemet Electronics Corporation
- Applicant Address: US SC Simpsonville
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Agency: Patent Filing Specialist, Inc.
- Agent Joseph T. Guy
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/38 ; H01G13/00 ; H01G4/232
Abstract:
An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp.
Public/Granted literature
- US20140160624A1 Multi-Layered Ceramic Capacitor with Soft Leaded Module Public/Granted day:2014-06-12
Information query
