Invention Grant
- Patent Title: Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
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Application No.: US15867563Application Date: 2018-01-10
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Publication No.: US10233074B2Publication Date: 2019-03-19
- Inventor: Kurt Peter Wachtler , Makoto Yoshino , Ayumu Kuroda , Brian E. Goodlin , Karen Kirmse , Benjamin Cook , Genki Yano , Stuart Jacobsen
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00 ; H01L23/31 ; H01L23/495
Abstract:
A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.
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