公开(公告)号：US20180127266A1

公开(公告)日：2018-05-10

申请号：US15867563

申请日：2018-01-10

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00

CPC classification number: B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US20170197823A1

公开(公告)日：2017-07-13

申请号：US15134574

申请日：2016-04-21

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81C1/00 ,  H01L21/02 ,  B81B7/00

CPC classification number: B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US11498831B2

公开(公告)日：2022-11-15

申请号：US16941138

申请日：2020-07-28

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/31 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US10723616B2

公开(公告)日：2020-07-28

申请号：US16266227

申请日：2019-02-04

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81B1/00 ,  H01L23/31 ,  B81C1/00 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US20190169019A1

公开(公告)日：2019-06-06

申请号：US16266227

申请日：2019-02-04

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  H01L23/31 ,  B81C1/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US10233074B2

公开(公告)日：2019-03-19

申请号：US15867563

申请日：2018-01-10

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/31 ,  H01L23/495

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

公开(公告)号：US09896330B2

公开(公告)日：2018-02-20

申请号：US15134574

申请日：2016-04-21

Applicant: Texas Instruments Incorporated

Inventor： Kurt Peter Wachtler ,  Makoto Yoshino ,  Ayumu Kuroda ,  Brian E. Goodlin ,  Karen Kirmse ,  Benjamin Cook ,  Genki Yano ,  Stuart Jacobsen

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B7/0054 ,  B81B2207/012 ,  B81B2207/097 ,  B81B2207/99 ,  B81C1/00325 ,  B81C2203/0136 ,  B81C2203/0154 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49541 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.