Invention Grant
- Patent Title: Semiconductor laser module and three-dimensional laminating and shaping apparatus
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Application No.: US15513371Application Date: 2016-09-14
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Publication No.: US10234645B2Publication Date: 2019-03-19
- Inventor: Yuta Ishige , Etsuji Katayama , Hajime Mori
- Applicant: TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
- Applicant Address: JP Tokyo
- Assignee: TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
- Current Assignee: TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry LLP
- International Application: PCT/JP2016/077102 WO 20160914
- International Announcement: WO2018/051430 WO 20180322
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H01S5/022 ; H01S5/024 ; G02B19/00 ; G02B27/09 ; H01S5/40 ; B22F3/105 ; H01S5/00 ; B29C64/153 ; B29C64/268

Abstract:
A variation in coupling ratio of output light from a laser element to an optical fiber is suppressed. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of the semiconductor laser elements to the optical fiber, and a housing that implements the laser elements, the condenser, and the optical fiber includes at least one thin plate that is arranged between the laser elements and a top of the housing, and arranged on the top to form a gap with the top.
Public/Granted literature
- US20180231724A1 SEMICONDUCTOR LASER MODULE AND THREE-DIMENSIONAL LAMINATING AND SHAPING APPARATUS Public/Granted day:2018-08-16
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