- 专利标题: Method for fabricating semiconductor device
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申请号: US15099581申请日: 2016-04-14
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公开(公告)号: US10236179B2公开(公告)日: 2019-03-19
- 发明人: Fu-Cheng Yen , Tsung-Mu Yang , Sheng-Hsu Liu , Tsang-Hsuan Wang , Chun-Liang Kuo , Yu-Ming Hsu , Chung-Min Tsai , Yi-Wei Chen
- 申请人: UNITED MICROELECTRONICS CORP.
- 申请人地址: TW Hsin-Chu
- 专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人地址: TW Hsin-Chu
- 代理商 Winston Hsu
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L29/78 ; H01L29/66
摘要:
A method for forming an epitaxial layer on a substrate is disclosed. The method includes the steps of: providing a substrate into a chamber; injecting a precursor and a carrier gas to form the epitaxial layer on the substrate at a starting pressure; and pumping down the starting pressure to a second pressure according to a gradient during a cool down process in the chamber.
公开/授权文献
- US20170301536A1 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 公开/授权日:2017-10-19
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