Invention Grant
- Patent Title: Method for fabricating semiconductor device
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Application No.: US15099581Application Date: 2016-04-14
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Publication No.: US10236179B2Publication Date: 2019-03-19
- Inventor: Fu-Cheng Yen , Tsung-Mu Yang , Sheng-Hsu Liu , Tsang-Hsuan Wang , Chun-Liang Kuo , Yu-Ming Hsu , Chung-Min Tsai , Yi-Wei Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/78 ; H01L29/66

Abstract:
A method for forming an epitaxial layer on a substrate is disclosed. The method includes the steps of: providing a substrate into a chamber; injecting a precursor and a carrier gas to form the epitaxial layer on the substrate at a starting pressure; and pumping down the starting pressure to a second pressure according to a gradient during a cool down process in the chamber.
Public/Granted literature
- US20170301536A1 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2017-10-19
Information query
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