Invention Grant
- Patent Title: System and method for measuring substrate and film thickness distribution
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Application No.: US15622629Application Date: 2017-06-14
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Publication No.: US10236222B2Publication Date: 2019-03-19
- Inventor: Dengpeng Chen , Andrew Zeng
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L21/44 ; H01L21/66 ; H01L21/67 ; G01B21/08

Abstract:
The system includes a dual interferometer sub-system configured to measure flatness across a substrate. The system includes a mass sensor configured to measure the mass of the substrate. The system includes a controller communicatively coupled to the dual interferometer sub-system and the mass sensor. The controller includes one or more processors. The one or more processors are configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to determine a thickness distribution of at least one of the substrate or a film deposited on the substrate as a function of position across the substrate based on one or more flatness measurements from the dual interferometer sub-system and one or more mass measurements from the mass sensor.
Public/Granted literature
- US20180226304A1 System and Method for Measuring Substrate and Film Thickness Distribution Public/Granted day:2018-08-09
Information query
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