Invention Grant
- Patent Title: High voltage metal oxide semiconductor device and manufacturing method thereof
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Application No.: US15889051Application Date: 2018-02-05
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Publication No.: US10236375B2Publication Date: 2019-03-19
- Inventor: Tsung-Yi Huang , Chu-Feng Chen
- Applicant: RICHTEK TECHNOLOGY CORPORATION
- Applicant Address: TW Zhubei, Hsinchu
- Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee Address: TW Zhubei, Hsinchu
- Agency: Tung & Associates
- Priority: TW106115549A 20170511
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/08 ; H01L29/06 ; H01L29/66 ; H01L21/265 ; H01L21/762 ; H01L21/266

Abstract:
A high voltage MOS device includes: a well region with a first conductive type, a body region with a second conductive type, a gate, plural source regions with the first conductive type, a drain region with the first conductive type, and a body contact region with the second conductive type. The plural source regions contact the gate, and are substantially arranged in parallel along a width direction, and each two neighboring source regions are not contacted with each other. The body connection region extends along the width direction and overlaps with at least two of the source regions, such that the body connection region includes at least a first region and a second region, wherein the first region overlaps with at least one of the source regions, and the second region does not overlap any of the regions. The contact region does not contact the gate along a lateral direction.
Public/Granted literature
- US20180331211A1 HIGH VOLTAGE METAL OXIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-11-15
Information query
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