Invention Grant
- Patent Title: Dual form factor devices having operative and complementary aligning components
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Application No.: US15874675Application Date: 2018-01-18
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Publication No.: US10237461B2Publication Date: 2019-03-19
- Inventor: Nishanth Ramaprakash , Prasanna Krishnaswamy , Sreenidhi A. Koti , Arvind S
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal LLP
- Priority: IN201741007184 20170301
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G02B7/10 ; H04N5/247
Abstract:
Embodiments relate to mobile devices and systems having an operative component integrated into a first housing and a complementary component within an opening of a second housing moveably coupled to the first housing such that, in a particular configuration of the device or system, the operative component is aligned with the complementary component to enhance performance of the operative component.
Public/Granted literature
- US20180255219A1 DUAL FORM FACTOR DEVICES HAVING OPERATIVE AND COMPLEMENTARY ALIGNING COMPONENTS Public/Granted day:2018-09-06
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