In one aspect, a thermal cycler system is disclosed. The thermal cycler can be comprised of a device housing and a cover that is operably connected to the device housing. The cover can include a handle portion, a device lid portion, a sample block platen, and a link bar. The device lid portion is attached to the proximal side of the handle portion with a first pin. The sample block platen is operably connected to the handle portion such that the sample block platen is positioned against the sample block when the handle portion is flush with the device lid portion and the cover is in a closed position. The link bar is pivotably connected to the device housing at a first terminal end portion and a second pin at an opposite second terminal end portion, wherein the handle portion is elevated away from the device lid portion before the cover is moved to an open position.