Invention Grant
- Patent Title: Semiconductor apparatus, stack semiconductor apparatus, and test method of the stack semiconductor apparatus
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Application No.: US15207526Application Date: 2016-07-12
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Publication No.: US10241150B2Publication Date: 2019-03-26
- Inventor: Seung-han Woo , Reum Oh , Hae-suk Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0123188 20150831
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L21/66 ; H01L23/48 ; H01L25/065
Abstract:
A semiconductor apparatus includes two or more semiconductor chips and a tester. The two or more semiconductor chips are electrically connected through one or more through-silicon vias (TSVs). The tester is on at least one of the two or more semiconductor chips and tests the state of at least one TSV based on an output signal of the TSV. The TSV is selected as a signal transmission TSV based on the state of the TSV.
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