Invention Grant
- Patent Title: Semiconductor device packages
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Application No.: US15201095Application Date: 2016-07-01
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Publication No.: US10241264B2Publication Date: 2019-03-26
- Inventor: Yi-Min Chin , Yung-Shun Chang , Mei-Ju Lu , Jia-Hao Zhang , Wen-Chi Hung
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/12
Abstract:
A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.
Public/Granted literature
- US20180003894A1 SEMICONDUCTOR DEVICE PACKAGES Public/Granted day:2018-01-04
Information query
