Invention Grant
- Patent Title: Method and apparatus for de-chucking a workpiece using a swing voltage sequence
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Application No.: US15628396Application Date: 2017-06-20
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Publication No.: US10242893B2Publication Date: 2019-03-26
- Inventor: Haitao Wang , Wonseok Lee , Sergio Fukuda Shoji , Chunlei Zhang , Kartik Ramaswamy
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/683

Abstract:
A method and apparatus for de-chucking a workpiece is described that uses a swing voltage sequence. One example pertains to a method that includes applying a mechanical force from an electrostatic chuck against the back side of a workpiece that is electrostatically clamped to the chuck, applying a sequence of voltage pulses with a same polarity to the electrodes, each pulse of the sequence having a lower voltage than the preceding pulse, each pulse of the sequence having a lower voltage than the preceding pulse, and determining whether the workpiece is released from the chuck after the sequence of additional voltage pulses and if the workpiece is not released then repeating applying the sequence of voltage pulses.
Public/Granted literature
- US20180366359A1 METHOD AND APPARATUS FOR DE-CHUCKING A WORKPIECE USING A SWING VOLTAGE SEQUENCE Public/Granted day:2018-12-20
Information query
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