发明授权
- 专利标题： Apparatus for direct transfer of semiconductor devices with needle retraction support
-
申请号： US15978092申请日： 2018-05-12
-
公开(公告)号： US10242971B2公开(公告)日： 2019-03-26
- 发明人: Andrew Huska , Cody Peterson , Clinton Adams , Sean Kupcow
- 申请人： Rohinni, LLC
- 申请人地址： US ID Coeur d'Alene
- 专利权人： Rohinni, LLC
- 当前专利权人： Rohinni, LLC
- 当前专利权人地址： US ID Coeur d'Alene
- 代理机构： Lee & Hayes, P.C.
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L25/075 ; H01L21/683 ; H01L21/48 ; H01L21/677 ; H01L21/68 ; H01L21/687 ; H01L21/66 ; H01L23/00 ; H01L23/544 ; H01L21/67 ; H01L33/62 ; G02F1/1335 ; H01L23/532
摘要：
An apparatus, for attaching a semiconductor device die to a circuit substrate, includes an elongated rod to press a holding substrate carrying the semiconductor device die into a position at which the semiconductor device die attaches to the circuit substrate; and a support including a base portion having a hole via which the elongated rod passes when actuated to press the holding substrate.
公开/授权文献
信息查询
IPC分类:
