Invention Grant
- Patent Title: Package structure and fabrication method thereof
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Application No.: US14986149Application Date: 2015-12-31
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Publication No.: US10242972B2Publication Date: 2019-03-26
- Inventor: Lu-Yi Chen , Chang-Lun Lu , Shih-Ching Chen , Guang-Hwa Ma , Cheng-Hsu Hsiao
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW104104027A 20150206
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/78 ; H01L25/10 ; H01L21/683 ; H01L23/538 ; H01L23/31 ; H01L25/03

Abstract:
A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a circuit sub-layer formed in the dielectric layer; an electronic element disposed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; a plurality of conductive posts formed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; and an encapsulant formed on the first surface of the dielectric layer and encapsulating the electronic element and the conductive posts. Upper surfaces of the conductive posts are exposed from the encapsulant so as to allow another electronic element to be disposed on the conductive posts and electrically connected to the circuit sub-layer through the conductive posts, thereby overcoming the conventional drawback that another electronic element can only be disposed on a lower side of a package structure and improving the functionality of the package structure.
Public/Granted literature
- US20160233194A1 PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2016-08-11
Information query
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