- 专利标题: Semiconductor device and method for manufacturing semiconductor device
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申请号: US15778270申请日: 2016-11-14
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公开(公告)号: US10243083B2公开(公告)日: 2019-03-26
- 发明人: Seiichi Uchida , Kuniaki Okada
- 申请人: Sharp Kabushiki Kaisha
- 申请人地址: JP Sakai
- 专利权人: SHARP KABUSHIKI KAISHA
- 当前专利权人: SHARP KABUSHIKI KAISHA
- 当前专利权人地址: JP Sakai
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2015-228616 20151124
- 国际申请: PCT/JP2016/083688 WO 20161114
- 国际公布: WO2017/090477 WO 20170601
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/786 ; G02F1/1343 ; G02F1/1368 ; G09F9/30 ; H01L21/28 ; H01L29/41 ; G02F1/1362 ; H01L27/12 ; H01L29/24
摘要:
A semiconductor device (1001) includes: a thin film transistor (101) including an oxide semiconductor layer (16) including a channel region, and a source contact region and a drain contact region arranged on opposite sides of the channel region; an insulating layer arranged so as to cover the oxide semiconductor layer (16), the insulating layer having a contact hole (CH) through which the drain contact region is exposed; and a transparent electrode (24) to be in contact with the drain contact region in the contact hole (CH), wherein: as seen from a direction normal to the substrate, at least a part R of the drain contact region overlaps a gate electrode (12); and on an arbitrary cross section that extends in a channel width direction across the at least part (R) of the drain contact region, a width of the oxide semiconductor layer (16) is greater than a width of the gate electrode (12), and the gate electrode (12) is covered by the oxide semiconductor layer (16) with the gate insulating layer therebetween.
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