Invention Grant
- Patent Title: Light emitting device and method for manufacturing thereof
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Application No.: US15717183Application Date: 2017-09-27
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Publication No.: US10243107B2Publication Date: 2019-03-26
- Inventor: Tetsuya Ishikawa , Gensui Tamura
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2016-190027 20160928; JP2017-184459 20170926
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L33/54 ; H01L33/62

Abstract:
A light emitting device includes a resin molding, first and second leads, and a light emitting element. The resin molding includes a front surface defining an opening, and a lower surface adjacent to the front surface. The first and second leads each includes an outer lead portion and an inner lead portion. The outer lead portion protrudes from the lower surface of the resin molding, and includes a bent portion bent along the lower surface. A surface on an inner side of the bent portion including a first recessed section. The inner lead portion includes an embedded portion embedded in the resin molding, and an exposed portion exposed in the opening. A surface of the embedded portion opposite from the surface where the first recessed section is provided includes a second recessed with a part of the resin molding being positioned in the second recessed section.
Public/Granted literature
- US20180090644A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2018-03-29
Information query
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