-
公开(公告)号：US10243107B2
公开(公告)日：2019-03-26
申请号：US15717183
申请日：2017-09-27
Applicant: NICHIA CORPORATION
Inventor： Tetsuya Ishikawa , Gensui Tamura
Abstract: A light emitting device includes a resin molding, first and second leads, and a light emitting element. The resin molding includes a front surface defining an opening, and a lower surface adjacent to the front surface. The first and second leads each includes an outer lead portion and an inner lead portion. The outer lead portion protrudes from the lower surface of the resin molding, and includes a bent portion bent along the lower surface. A surface on an inner side of the bent portion including a first recessed section. The inner lead portion includes an embedded portion embedded in the resin molding, and an exposed portion exposed in the opening. A surface of the embedded portion opposite from the surface where the first recessed section is provided includes a second recessed with a part of the resin molding being positioned in the second recessed section.
-
公开(公告)号：US10727387B2
公开(公告)日：2020-07-28
申请号：US16795496
申请日：2020-02-19
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Gensui Tamura
Abstract: Alight emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.
-
公开(公告)号：US12111024B2
公开(公告)日：2024-10-08
申请号：US17963904
申请日：2022-10-11
Applicant: NICHIA CORPORATION
Inventor： Gensui Tamura
IPC: F21K9/00 , F21K9/68 , F21K9/90 , F21Y105/16
CPC classification number: F21K9/90 , F21K9/68 , F21Y2105/16
Abstract: A planar light source includes a light source having a pair of electrodes on one face; a light guide member covering the light source while the electrodes are exposed from the light guide member; a wiring substrate having a wiring layer; a light reflecting sheet interposed between the light guide member and the wiring substrate and defining a pair of first through holes at positions aligned with the electrodes on a one-to-one basis; and a pair of conducting members respectively disposed in the first through holes and electrically connecting the electrodes to the wiring layer. The light reflecting sheet includes a first light reflecting sheet defining the first through holes, and a second light reflecting sheet defining a second through hole at a position overlapping the first through holes in a plan view with the light source being disposed in the second through hole in the plan view.
-
Patent Agency Ranking
公开(公告)号：US11165006B2
公开(公告)日：2021-11-02
申请号：US16582197
申请日：2019-09-25
Applicant: NICHIA CORPORATION
Inventor： Toru Hashimoto , Yoichi Bando , Tadaaki Ikeda , Gensui Tamura
IPC: H01L33/62 , H01L33/40 , H01L25/075
Abstract: The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.
-
公开(公告)号：US11581465B2
公开(公告)日：2023-02-14
申请号：US17174804
申请日：2021-02-12
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Gensui Tamura
Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.
-
公开(公告)号：US11499684B2
公开(公告)日：2022-11-15
申请号：US17227827
申请日：2021-04-12
Applicant: NICHIA CORPORATION
Inventor： Gensui Tamura
IPC: F21K9/90 , F21K9/68 , F21Y105/16
Abstract: A planar light source includes a light source, a light guide member, a wiring substrate, a light reflecting sheet and a pair of conducting members. The light source has a pair of electrodes on one face. The light guide member covers the light source while the electrodes are exposed from the light guide member. The wiring substrate has a wiring layer. The light reflecting sheet is interposed between the light guide member and the wiring substrate and defining a pair of first through holes at positions aligned with the electrodes on a one-to-one basis. The conducting members are respectively disposed in the first through holes and electrically connecting the electrodes to the wiring layer.
-
公开(公告)号：US10950772B2
公开(公告)日：2021-03-16
申请号：US16906687
申请日：2020-06-19
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Gensui Tamura
Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.
-
公开(公告)号：US10608154B2
公开(公告)日：2020-03-31
申请号：US16229666
申请日：2018-12-21
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Gensui Tamura
Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.
-
-
-
-
-
-
-
Search Results
8
records
(took 0.017 seconds)
