Invention Grant
- Patent Title: Self-calibrated thermal sensors of an integrated circuit die
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Application No.: US15285405Application Date: 2016-10-04
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Publication No.: US10247624B2Publication Date: 2019-04-02
- Inventor: Mohamed A. Abdelmoneum , David E. Duarte , Gregory F. Taylor
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: G01K15/00
- IPC: G01K15/00 ; G01K7/00 ; G01K11/00 ; G01K7/32

Abstract:
Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20170038265A1 SELF-CALIBRATED THERMAL SENSORS OF AN INTEGRATED CIRCUIT DIE Public/Granted day:2017-02-09
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