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公开(公告)号：US09702769B2
公开(公告)日：2017-07-11
申请号：US13915453
申请日：2013-06-11
Applicant: Intel Corporation
Inventor： Mohamed A. Abdelmoneum , David E. Duarte , Gregory F. Taylor
CPC classification number: G01K15/005 , G01K7/00 , G01K7/32
Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.
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公开(公告)号：US20170038265A1
公开(公告)日：2017-02-09
申请号：US15285405
申请日：2016-10-04
Applicant: INTEL CORPORATION
Inventor： Mohamed A. Abdelmoneum , David E. Duarte , Gregory F. Taylor
CPC classification number: G01K15/005 , G01K7/00 , G01K7/32
Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.
Abstract translation: 本公开的实施例提供集成电路（IC）管芯的自校准热传感器以及相关技术和配置。 在一个实施例中，自校准热感测装置包括配置成以对应于集成电路（IC）管芯的电路的温度的频率振荡的谐振器，其中谐振器与电路热耦合并且被配置为在 第一模式和第二模式以及与谐振器可操作地耦合的逻辑，并且被配置为使用第一等式计算与第一模式中的谐振器的第一频率相对应的第一温度，计算对应于谐振器的第二频率的第二温度 在第二模式中使用第二等式，并且基于第一温度和第二温度的比较的结果，向第一等式和第二等式添加偏移。 可以描述和/或要求保护其他实施例。
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公开(公告)号：US09470586B2
公开(公告)日：2016-10-18
申请号：US13915453
申请日：2013-06-11
Applicant: Intel Corporation
Inventor： Mohamed A. Abdelmoneum , David E. Duarte , Gregory F. Taylor
Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.
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公开(公告)号：US10247624B2
公开(公告)日：2019-04-02
申请号：US15285405
申请日：2016-10-04
Applicant: INTEL CORPORATION
Inventor： Mohamed A. Abdelmoneum , David E. Duarte , Gregory F. Taylor
Abstract: Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.
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