A printed wiring board includes a support plate, and a build-up wiring layer including resin insulating layers and conductor layers and having a first surface and a second surface on the opposite side with respect to the first surface such that the support plate is positioned on the first surface of the build-up wiring layer. The resin insulating layers in the build-up wiring layer include a first resin insulating layer that forms the second surface of the build-up wiring layer, and the build-up wiring layer includes first conductor pads embedded in the first resin insulating layer such that each of the first conductor pads has an exposed surface exposed from the second surface of the build-up wiring layer.