公开(公告)号：US20180053715A1

公开(公告)日：2018-02-22

申请号：US15681695

申请日：2017-08-21

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Hiroyuki Ban ,  Haiying Mei

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/768

CPC classification number: H01L23/49822 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76885 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1533 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.

公开(公告)号：US10674604B2

公开(公告)日：2020-06-02

申请号：US15339057

申请日：2016-10-31

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Hiroyuki Ban ,  Haiying Mei

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/06 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H05K1/05 ,  H05K3/40 ,  H05K3/00 ,  H05K3/20 ,  H01L21/683 ,  H01L23/31

Abstract: A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.

公开(公告)号：US10256175B2

公开(公告)日：2019-04-09

申请号：US15681695

申请日：2017-08-21

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Hiroyuki Ban ,  Haiying Mei

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/768 ,  H01L23/31

Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on a first surface side of the laminate and second conductor pads on a second surface side of the laminate, and a solder resist layer interposed between the support plate and the laminate and having openings formed such that the openings are exposing the first conductor pads respectively. The laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on the opposite side with respect to the first surface of the laminate, the second conductor pads are embedded in the second surface of the laminate such that the second conductor pads have surfaces recessed from the second surface of the laminate respectively.

公开(公告)号：US10249561B2

公开(公告)日：2019-04-02

申请号：US15581253

申请日：2017-04-28

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Haiying Mei ,  Hiroyuki Ban

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/18 ,  H01L21/52 ,  H01L23/00 ,  H05K3/40 ,  H05K3/46 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34

Abstract: A printed wiring board includes a support plate, and a build-up wiring layer including resin insulating layers and conductor layers and having a first surface and a second surface on the opposite side with respect to the first surface such that the support plate is positioned on the first surface of the build-up wiring layer. The resin insulating layers in the build-up wiring layer include a first resin insulating layer that forms the second surface of the build-up wiring layer, and the build-up wiring layer includes first conductor pads embedded in the first resin insulating layer such that each of the first conductor pads has an exposed surface exposed from the second surface of the build-up wiring layer.

公开(公告)号：US10271430B2

公开(公告)日：2019-04-23

申请号：US15682721

申请日：2017-08-22

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Hiroyuki Ban ,  Haiying Mei

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/02 ,  H05K3/06 ,  H05K3/46 ,  H05K3/40 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34

Abstract: A printed wiring board includes a support plate, a laminate formed on the support plate and including first conductor pads on first surface side of the laminate and first via conductors on second surface side of the laminate, and a solder resist layer interposed between the plate and the laminate and having openings formed such that the openings are exposing the first pads. The laminate has first surface on the first surface side and second surface on the second surface side on the opposite side and includes a first resin insulating layer forming the second surface of the laminate, and the first conductors are formed through the first insulating layer such that the first vias are tapering from the first surface side toward the second surface side of the laminate and have end surfaces recessed from the second surface of the laminate on the second surface side of the laminate.

公开(公告)号：US10004143B2

公开(公告)日：2018-06-19

申请号：US15252286

申请日：2016-08-31

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Haiying Mei ,  Hiroyuki Ban

IPC: H05K1/03 ,  H05K1/18 ,  H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H05K3/46 ,  H01L23/13 ,  H01L23/498 ,  H05K3/00 ,  H05K3/20 ,  H01L23/31 ,  H01L25/10

CPC classification number: H05K1/183 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1533 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/09127 ,  H01L2924/00014

Abstract: A printed wiring board includes a first circuit substrate having a first surface and a second surface on the opposite side, and a second circuit substrate having a third surface and a fourth surface on the opposite side such that the first circuit substrate is laminated on the third surface and that the first surface and the third surface are opposing each other. The second circuit substrate has a mounting area on the third surface and includes pads positioned to mount an electronic component in the mounting area and a connection wire structure connected to the pads, and the first circuit substrate includes through-hole conductors extending from the first surface to the second surface and connected to the pads through the connection wire structure and has an opening portion formed through the first circuit substrate such that the opening portion is exposing the pads formed in the mounting area.

公开(公告)号：US09949372B2

公开(公告)日：2018-04-17

申请号：US15441540

申请日：2017-02-24

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Hiroyuki Ban ,  Haiying Mei

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/20 ,  H05K3/28 ,  H05K3/30 ,  H05K3/38 ,  H05K3/40 ,  H01L23/495 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K1/115 ,  H01L23/49534 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/113 ,  H05K3/0061 ,  H05K3/025 ,  H05K3/205 ,  H05K3/243 ,  H05K3/284 ,  H05K3/303 ,  H05K3/388 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09527 ,  H05K2201/10674 ,  H01L2924/00012

Abstract: A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.