Invention Grant
- Patent Title: Embedded coil assembly and production method
-
Application No.: US14576934Application Date: 2014-12-19
-
Publication No.: US10256027B2Publication Date: 2019-04-09
- Inventor: Haiying Li , Benjamin Michael Sutton , Ming Li
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F41/04 ; H01F41/12 ; H01F17/00 ; H01F17/06 ; H01F27/02

Abstract:
An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.
Public/Granted literature
- US20160181004A1 EMBEDDED COIL ASSEMBLY AND PRODUCTION METHOD Public/Granted day:2016-06-23
Information query