Invention Grant
- Patent Title: SOI island in a power semiconductor device
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Application No.: US15675913Application Date: 2017-08-14
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Publication No.: US10256299B2Publication Date: 2019-04-09
- Inventor: Alexander Philippou , Anton Mauder
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102016115334 20160818
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L29/06 ; H01L21/02 ; H01L21/311 ; H01L27/06 ; H01L29/10 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/739 ; H01L29/78

Abstract:
A power semiconductor device includes a semiconductor-on-insulator island having a semiconductor region and an insulation structure, the insulation structure being formed by an oxide and separating the semiconductor region from a portion of a semiconductor body of the power semiconductor device. The insulation structure includes a sidewall that laterally confines the semiconductor region; a bottom that vertically confines the semiconductor region; and a local deepening that forms at least a part of a transition between the sidewall and the bottom, wherein the local deepening extends further along the extension direction as compared to the bottom.
Public/Granted literature
- US20180053822A1 SOI Island in a Power Semiconductor Device Public/Granted day:2018-02-22
Information query
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