Curable composition for inkjet, and method for manufacturing electronic component
Abstract:
Provided is a curable composition for inkjet which can have a prolonged pot life even under an environment in an inkjet device that is warmed to 50° C. or higher and which can be cured into a cured product having improved heat resistance and insulation reliability, in spite of the fact that a thermally curable compound is used in the curable composition. The curable composition for inkjet according to the present invention contains a photocurable compound, a thermally curable compound, a photopolymerization initiator and a thermal curing agent and does not contain a solvent or contains the solvent, wherein the content of the solvent in 100% by weight of the curable composition is 1% by weight or less when the curable composition for inkjet contains the solvent, the photocurable compound contains a polyfunctional compound having at least two (meth)acryloyl groups, and the thermal curing agent is an aromatic amine having at least one benzene ring and at least two amino groups.
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