Invention Grant
- Patent Title: Curable composition for inkjet, and method for manufacturing electronic component
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Application No.: US15526276Application Date: 2016-02-12
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Publication No.: US10259773B2Publication Date: 2019-04-16
- Inventor: Mitsuru Tanikawa , Ryosuke Takahashi , Takanori Inoue , Michihisa Ueda , Tasuku Yamada , Yoshito Fujita , Takashi Watanabe , Yusuke Fujita
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2015-025587 20150212; JP2015-055074 20150318; JP2016-001206 20160106
- International Application: PCT/JP2016/054123 WO 20160212
- International Announcement: WO2016/129670 WO 20160818
- Main IPC: C07C211/51
- IPC: C07C211/51 ; C07D231/12 ; C07D249/04 ; C07D249/08 ; C09D11/101 ; C09D11/36 ; C09D11/38 ; H05K3/28 ; H05K1/03

Abstract:
Provided is a curable composition for inkjet which can have a prolonged pot life even under an environment in an inkjet device that is warmed to 50° C. or higher and which can be cured into a cured product having improved heat resistance and insulation reliability, in spite of the fact that a thermally curable compound is used in the curable composition. The curable composition for inkjet according to the present invention contains a photocurable compound, a thermally curable compound, a photopolymerization initiator and a thermal curing agent and does not contain a solvent or contains the solvent, wherein the content of the solvent in 100% by weight of the curable composition is 1% by weight or less when the curable composition for inkjet contains the solvent, the photocurable compound contains a polyfunctional compound having at least two (meth)acryloyl groups, and the thermal curing agent is an aromatic amine having at least one benzene ring and at least two amino groups.
Public/Granted literature
- US20170298005A1 CURABLE COMPOSITION FOR INKJET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2017-10-19
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