Invention Grant
- Patent Title: Apparatus and method for reducing substrate sliding in process chambers
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Application No.: US15457981Application Date: 2017-03-13
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Publication No.: US10262877B2Publication Date: 2019-04-16
- Inventor: Sriskantharajah Thirunavukarasu , Kirankumar Savandaiah , Cheng-Hsiung Tsai , Kai Liang Liew
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01L21/306 ; C23C16/50 ; C23C14/50 ; C23C16/458 ; H01J37/32 ; H01L21/683 ; H01J37/34

Abstract:
Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface.
Public/Granted literature
- US20170186631A1 APPARATUS AND METHOD FOR REDUCING SUBSTRATE SLIDING IN PROCESS CHAMBERS Public/Granted day:2017-06-29
Information query
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