公开(公告)号：US11629409B2

公开(公告)日：2023-04-18

申请号：US16424302

申请日：2019-05-28

Applicant: APPLIED MATERIALS, INC.

Inventor： Ribhu Gautam ,  Ananthkrishna Jupudi ,  Tuck Foong Koh ,  Preetham P. Rao ,  Vinodh Ramachandran ,  Yueh Sheng Ow ,  Yuichi Wada ,  Cheng-Hsiung Tsai ,  Kai Liang Liew

IPC: C23C16/511 ,  B01J19/12 ,  C23C16/54 ,  H05B6/64 ,  H01J37/32

Abstract: Methods and apparatus for a substrate processing chamber are provided herein. In some embodiments, a substrate processing chamber includes a chamber body having sidewalls defining an interior volume having a polygon shape; a selectively sealable elongated opening disposed in an upper portion of the chamber body for transferring one or more substrates into or out of the chamber body; a funnel disposed at a first end of the chamber body, wherein the funnel increases in size along a direction from an outer surface of the chamber body to the interior volume; and a pump port disposed at a second end of the chamber body opposite the funnel.

公开(公告)号：US11289357B2

公开(公告)日：2022-03-29

申请号：US16550521

申请日：2019-08-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Yuichi Wada ,  Yueh Sheng Ow ,  Ananthkrishna Jupudi ,  Clinton Goh ,  Kai Liang Liew ,  Sarath Babu

IPC: H01L21/683

Abstract: Methods and apparatus for increasing voltage breakdown levels of an electrostatic chuck in a process chamber. A soft anodization layer with a thickness of greater than zero and less than approximately 10 microns is formed on an aluminum base of the electrostatic chuck. The soft anodization layer remains thermally elastic in a temperature range of approximately −50 degrees Celsius to approximately 100 degrees Celsius. An alumina spray coating is then applied on the soft anodization layer. The soft anodization layer provides thermal stress relief between the aluminum base and the alumina spray coating to reduce/eliminate cracking caused by the thermal expansion rate differences between the aluminum base and the alumina spray coating.

公开(公告)号：US10262877B2

公开(公告)日：2019-04-16

申请号：US15457981

申请日：2017-03-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Sriskantharajah Thirunavukarasu ,  Kirankumar Savandaiah ,  Cheng-Hsiung Tsai ,  Kai Liang Liew

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/306 ,  C23C16/50 ,  C23C14/50 ,  C23C16/458 ,  H01J37/32 ,  H01L21/683 ,  H01J37/34

Abstract: Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface.

公开(公告)号：US09595464B2

公开(公告)日：2017-03-14

申请号：US14752245

申请日：2015-06-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Sriskantharajah Thirunavukarasu ,  Kirankumar Savandaiah ,  Cheng-Hsiung Tsai ,  Kai Liang Liew

IPC: H01L21/687 ,  H01L21/306 ,  C23C16/50 ,  C23C14/50 ,  C23C16/458 ,  H01J37/32 ,  H01L21/683 ,  H01J37/34

CPC classification number: H01L21/67069 ,  C23C14/50 ,  C23C16/458 ,  C23C16/4586 ,  C23C16/50 ,  H01J37/32009 ,  H01J37/32082 ,  H01J37/32577 ,  H01J37/3405 ,  H01J2237/3321 ,  H01J2237/334 ,  H01L21/306 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/68742 ,  H01L21/68757

Abstract: Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface.

Abstract translation: 本文公开了用于处理基底的方法和装置。 在一些实施例中，用于处理衬底的设备包括：衬底支撑件，其具有包括电绝缘涂层的衬底支撑表面; 基板升降机构，其包括多个提升销，所述多个提升销构造成在布置在所述基板支撑表面下方的第一位置和设置在所述基板支撑表面之上的第二位置之间移动; 以及连接器，被配置为在所述多个提升销到达所述基板支撑表面的平面之前，选择性地在所述基板支撑件和所述基板升降机构之间提供电连接。