Invention Grant
- Patent Title: Bi-directional heatsink dampening force system
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Application No.: US15421709Application Date: 2017-02-01
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Publication No.: US10262919B2Publication Date: 2019-04-16
- Inventor: Phil Slight , Vic Chia
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Agency: Polsinelli PC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/40 ; H05K1/02
Abstract:
A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.
Public/Granted literature
- US20180220521A1 BI-DIRECTIONAL HEATSINK DAMPENING FORCE SYSTEM Public/Granted day:2018-08-02
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