公开(公告)号：US20180220521A1

公开(公告)日：2018-08-02

申请号：US15421709

申请日：2017-02-01

Applicant: Cisco Technology, Inc.

Inventor： Phil Slight ,  Vic Chia

IPC: H05K1/02 ,  H05K1/18 ,  H01L23/40

CPC classification number: H01L23/4006 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H05K1/0203 ,  H05K1/0209 ,  H05K7/2049 ,  H05K2201/066 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/10393 ,  H05K2201/10409

Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.

公开(公告)号：US10903140B2

公开(公告)日：2021-01-26

申请号：US16384494

申请日：2019-04-15

Applicant: Cisco Technology, Inc.

Inventor： Phil Slight ,  Vic Chia

IPC: H05K7/20 ,  H01L23/40 ,  H05K1/02

Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.

公开(公告)号：US20190244877A1

公开(公告)日：2019-08-08

申请号：US16384494

申请日：2019-04-15

Applicant: Cisco Technology, Inc.

Inventor： Phil Slight ,  Vic Chia

IPC: H01L23/40 ,  H05K1/02

CPC classification number: H01L23/4006 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H05K1/0203 ,  H05K1/0209 ,  H05K7/2049 ,  H05K2201/066 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/10393 ,  H05K2201/10409

Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.

公开(公告)号：US10262919B2

公开(公告)日：2019-04-16

申请号：US15421709

申请日：2017-02-01

Applicant: Cisco Technology, Inc.

Inventor： Phil Slight ,  Vic Chia

IPC: H05K7/20 ,  H01L23/40 ,  H05K1/02

Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.