Invention Grant
- Patent Title: Microfluidic delivery system with a die on a rigid substrate
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Application No.: US14310601Application Date: 2014-06-20
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Publication No.: US10264667B2Publication Date: 2019-04-16
- Inventor: Simon Dodd , Joe Scheffelin , Dave Hunt , Steve Bush , Faiz Sherman
- Applicant: STMicroelectronics, Inc. , STMicroelectronics S.R.L. , STMicroelectronics International N.V.
- Applicant Address: US TX Coppell IT Agrate Brianza NL Schiphol
- Assignee: STMicroelectronics, Inc.,STMicroelectronics S.R.L.,STMicroelectronics International N.V.
- Current Assignee: STMicroelectronics, Inc.,STMicroelectronics S.R.L.,STMicroelectronics International N.V.
- Current Assignee Address: US TX Coppell IT Agrate Brianza NL Schiphol
- Agency: Seed IP Law Group LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; B41J2/175

Abstract:
The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.
Public/Granted literature
- US20150373840A1 MICROFLUIDIC DELIVERY SYSTEM WITH A DIE ON A RIGID SUBSTRATE Public/Granted day:2015-12-24
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