Invention Grant
- Patent Title: In-plane active cooling device for mobile electronics
-
Application No.: US15086039Application Date: 2016-03-30
-
Publication No.: US10267545B2Publication Date: 2019-04-23
- Inventor: Peng Wang , Unnikrishnan Vadakkanmaruveedu , Vinay Mitter
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C./QUALCOMM
- Main IPC: G06F1/20
- IPC: G06F1/20 ; F25B21/04 ; H01L23/38 ; H01L35/30 ; H01L35/32

Abstract:
An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.
Public/Granted literature
- US20170284708A1 IN-PLANE ACTIVE COOLING DEVICE FOR MOBILE ELECTRONICS Public/Granted day:2017-10-05
Information query