Invention Grant
- Patent Title: Sensing structure of alignment of a probe for testing integrated circuits
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Application No.: US15848996Application Date: 2017-12-20
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Publication No.: US10267849B2Publication Date: 2019-04-23
- Inventor: Alberto Pagani
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Crowe & Dunlevy
- Priority: ITVI2010A0159 20100610
- Main IPC: B06B1/00
- IPC: B06B1/00 ; G01R31/28 ; C12Q1/00 ; G01R1/067 ; H01L21/66 ; H01L21/00 ; G01N1/00 ; G01R11/00

Abstract:
A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.
Public/Granted literature
- US20180113168A1 SENSING STRUCTURE OF ALIGNMENT OF A PROBE FOR TESTING INTEGRATED CIRCUITS Public/Granted day:2018-04-26
Information query
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