Invention Grant
- Patent Title: Semiconductor packages having wire bond wall to reduce coupling
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Application No.: US15985640Application Date: 2018-05-21
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Publication No.: US10269729B2Publication Date: 2019-04-23
- Inventor: Shun Meen Kuo , Paul R. Hart , Margaret A. Szymanowski
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/552 ; H01L23/00 ; H03F1/02 ; H01L23/66 ; H03F3/195 ; H03F3/21

Abstract:
A device (e.g., a Doherty amplifier) housed in an air cavity package includes one or more isolation structures over a surface of a substrate and defining an active circuit area. The device also includes first and second adjacent circuits within the active circuit area, first and second leads coupled to the isolation structure(s) between opposite sides of the package and electrically coupled to the first circuit, third and fourth leads coupled to the isolation structure(s) between the opposite sides of the package and electrically coupled to the second circuit, a first terminal over the first side of the package between the first lead and the third lead, a second terminal over the second side of the package between the second lead and the fourth lead, and an electronic component coupled to the package and electrically coupled to the first terminal, the second terminal, or both the first and second terminals.
Public/Granted literature
- US20180269158A1 SEMICONDUCTOR PACKAGES HAVING WIRE BOND WALL TO REDUCE COUPLING Public/Granted day:2018-09-20
Information query
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