公开(公告)号：US10211787B2

公开(公告)日：2019-02-19

申请号：US16119832

申请日：2018-08-31

Applicant: NXP USA, Inc.

Inventor： Abdulrhman M. S. Ahmed ,  Mario M. Bokatius ,  Paul R. Hart ,  Joseph Staudinger ,  Richard E. Sweeney

IPC: H03F1/02 ,  H03G1/00 ,  G06F13/42 ,  H03F3/19 ,  H04L7/00 ,  H03F3/189 ,  H04L27/22 ,  H03F3/68 ,  H03F3/60 ,  H03F3/21 ,  G06G7/10

Abstract: Embodiments of circuits for use with an amplifier that includes multiple amplifier paths include a first circuit and a second circuit in parallel with the first circuit. The first circuit includes a first input coupled to a first power divider output, a first output coupled to a first amplifier path of the multiple amplifier paths, and a first adjustable phase shifter and a first attenuator series coupled between the first input and the first output. The second circuit includes a second input coupled to a second power divider output, a second output coupled to a second amplifier path of the multiple amplifier paths, and a second adjustable phase shifter coupled between the second input and the second output.

公开(公告)号：US09979355B2

公开(公告)日：2018-05-22

申请号：US15393473

申请日：2016-12-29

Applicant: NXP USA, Inc.

Inventor： Joseph Staudinger ,  Abdulrhman M. S. Ahmed ,  Paul R. Hart ,  Monte G. Miller ,  Nicholas J. Spence

IPC: H03F3/19 ,  H03F1/02 ,  H03F1/32 ,  H03F3/24

Abstract: An embodiment of an amplifier system includes a modifiable signal adjustment device with an RF signal adjustment circuit coupled between first and second nodes. The RF signal adjustment circuit includes an adjustable phase shifter and an adjustable attenuator coupled in series with each other. The device also includes a memory and a controller circuit. The controller circuit retrieves a phase shift value and an attenuation value from the memory. The controller circuit then controls the adjustable phase shifter to apply a phase shift corresponding to the phase shift value to an input RF signal received at the first node, and controls the adjustable attenuator to apply an attenuation corresponding to the attenuation value to the input RF signal. Applying the phase shift and the attenuation results in an output RF signal at the second node.

公开(公告)号：US20190181805A1

公开(公告)日：2019-06-13

申请号：US16274016

申请日：2019-02-12

Applicant: NXP USA, Inc.

Inventor： Abdulrhman M. S. Ahmed ,  Mario M. Bokatius ,  Paul R. Hart ,  Joseph Staudinger ,  Richard E, Sweeney

IPC: H03F1/02 ,  H04L7/00 ,  H03F3/21 ,  H03F3/60 ,  H03F3/68 ,  H03F3/189 ,  G06G7/10 ,  H03G1/00 ,  H04L27/22 ,  G06F13/42 ,  H03F3/19

CPC classification number: H03F1/0288 ,  G06F13/4282 ,  G06G7/10 ,  H03F3/189 ,  H03F3/19 ,  H03F3/211 ,  H03F3/602 ,  H03F3/68 ,  H03F2200/387 ,  H03F2200/438 ,  H03F2200/451 ,  H03F2203/21106 ,  H03F2203/21193 ,  H03G1/0088 ,  H03G2201/106 ,  H04L7/0079 ,  H04L27/22

Abstract: Embodiments of circuits for use with an amplifier that includes multiple amplifier paths include a first circuit and a second circuit in parallel with the first circuit. The first circuit includes a first input coupled to a first power divider output, a first output coupled to a first amplifier path of the multiple amplifier paths, and a first adjustable phase shifter and a first attenuator series coupled between the first input and the first output. The second circuit includes a second input coupled to a second power divider output, a second output coupled to a second amplifier path of the multiple amplifier paths, and a second adjustable phase shifter coupled between the second input and the second output.

公开(公告)号：US10069463B2

公开(公告)日：2018-09-04

申请号：US15874740

申请日：2018-01-18

Applicant: NXP USA, Inc.

Inventor： Abdulrhman M. S. Ahmed ,  Mario M. Bokatius ,  Paul R. Hart ,  Joseph Staudinger ,  Richard E. Sweeney

IPC: H03F3/68 ,  H03F1/02 ,  H03F3/21 ,  H03F3/60 ,  H03F3/189 ,  H04L7/00 ,  H03F3/19 ,  G06F13/42 ,  H04L27/22 ,  H03G1/00 ,  G06G7/10

Abstract: Embodiments of circuits for use with an amplifier that includes multiple amplifier paths include a first circuit and a second circuit in parallel with the first circuit. The first circuit includes a first input coupled to a first power divider output, a first output coupled to a first amplifier path of the multiple amplifier paths, and a first adjustable phase shifter and a first attenuator series coupled between the first input and the first output. The second circuit includes a second input coupled to a second power divider output, a second output coupled to a second amplifier path of the multiple amplifier paths, and a second adjustable phase shifter coupled between the second input and the second output.

公开(公告)号：US10027284B2

公开(公告)日：2018-07-17

申请号：US15393473

申请日：2016-12-29

Applicant: NXP USA, Inc.

Inventor： Joseph Staudinger ,  Abdulrhman M. S. Ahmed ,  Paul R. Hart ,  Monte G. Miller ,  Nicholas J. Spence

IPC: H03F3/19 ,  H03F1/02 ,  H03F1/32 ,  H03F3/24

Abstract: An embodiment of an amplifier system includes a modifiable signal adjustment device with an RF signal adjustment circuit coupled between first and second nodes. The RF signal adjustment circuit includes an adjustable phase shifter and an adjustable attenuator coupled in series with each other. The device also includes a memory and a controller circuit. The controller circuit retrieves a phase shift value and an attenuation value from the memory. The controller circuit then controls the adjustable phase shifter to apply a phase shift corresponding to the phase shift value to an input RF signal received at the first node, and controls the adjustable attenuator to apply an attenuation corresponding to the attenuation value to the input RF signal. Applying the phase shift and the attenuation results in an output RF signal at the second node.

公开(公告)号：US20170111014A1

公开(公告)日：2017-04-20

申请号：US15393473

申请日：2016-12-29

Applicant: NXP USA, Inc.

Inventor： Joseph Staudinger ,  Abdulrhman M. S. Ahmed ,  Paul R. Hart ,  Monte G. Miller ,  Nicholas J. Spence

IPC: H03F1/02 ,  H03F3/19 ,  H03F3/24 ,  H03F1/32

CPC classification number: H03F1/0288 ,  H03F1/3247 ,  H03F1/3282 ,  H03F3/19 ,  H03F3/245 ,  H03F2200/222 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2201/3233 ,  H03F2203/21106

Abstract: An embodiment of an amplifier system includes a modifiable signal adjustment device with an RF signal adjustment circuit coupled between first and second nodes. The RF signal adjustment circuit includes an adjustable phase shifter and an adjustable attenuator coupled in series with each other. The device also includes a memory and a controller circuit. The controller circuit retrieves a phase shift value and an attenuation value from the memory. The controller circuit then controls the adjustable phase shifter to apply a phase shift corresponding to the phase shift value to an input RF signal received at the first node, and controls the adjustable attenuator to apply an attenuation corresponding to the attenuation value to the input RF signal. Applying the phase shift and the attenuation results in an output RF signal at the second node.

公开(公告)号：US20180269158A1

公开(公告)日：2018-09-20

申请号：US15985640

申请日：2018-05-21

Applicant: NXP USA, Inc.

Inventor： Shun Meen Kuo ,  Paul R. Hart ,  Margaret A. Szymanowski

IPC: H01L23/552 ,  H01L23/00 ,  H03F1/02 ,  H03F3/195 ,  H03F3/21 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/66 ,  H01L24/04 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6655 ,  H01L2223/6661 ,  H01L2224/04042 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/85 ,  H01L2924/19107 ,  H01L2924/30111 ,  H03F1/0288 ,  H03F3/195 ,  H03F3/211 ,  H03F2200/222 ,  H03F2200/387 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A device (e.g., a Doherty amplifier) housed in an air cavity package includes one or more isolation structures over a surface of a substrate and defining an active circuit area. The device also includes first and second adjacent circuits within the active circuit area, first and second leads coupled to the isolation structure(s) between opposite sides of the package and electrically coupled to the first circuit, third and fourth leads coupled to the isolation structure(s) between the opposite sides of the package and electrically coupled to the second circuit, a first terminal over the first side of the package between the first lead and the third lead, a second terminal over the second side of the package between the second lead and the fourth lead, and an electronic component coupled to the package and electrically coupled to the first terminal, the second terminal, or both the first and second terminals.

公开(公告)号：US10432148B2

公开(公告)日：2019-10-01

申请号：US16274016

申请日：2019-02-12

Applicant: NXP USA, Inc.

Inventor： Abdulrhman M. S. Ahmed ,  Mario M. Bokatius ,  Paul R. Hart ,  Joseph Staudinger ,  Richard E. Sweeney

IPC: H03F1/02 ,  H03F3/21 ,  H03F3/60 ,  H03F3/68 ,  H03F3/189 ,  G06G7/10 ,  H03G1/00 ,  H04L27/22 ,  G06F13/42 ,  H03F3/19 ,  H04L7/00

Abstract: Embodiments of circuits for use with an amplifier that includes multiple amplifier paths include a first circuit and a second circuit in parallel with the first circuit. The first circuit includes a first input coupled to a first power divider output, a first output coupled to a first amplifier path of the multiple amplifier paths, and a first adjustable phase shifter and a first attenuator series coupled between the first input and the first output. The second circuit includes a second input coupled to a second power divider output, a second output coupled to a second amplifier path of the multiple amplifier paths, and a second adjustable phase shifter coupled between the second input and the second output.

公开(公告)号：US10269729B2

公开(公告)日：2019-04-23

申请号：US15985640

申请日：2018-05-21

Applicant: NXP USA, Inc.

Inventor： Shun Meen Kuo ,  Paul R. Hart ,  Margaret A. Szymanowski

IPC: H01L23/12 ,  H01L23/552 ,  H01L23/00 ,  H03F1/02 ,  H01L23/66 ,  H03F3/195 ,  H03F3/21

Abstract: A device (e.g., a Doherty amplifier) housed in an air cavity package includes one or more isolation structures over a surface of a substrate and defining an active circuit area. The device also includes first and second adjacent circuits within the active circuit area, first and second leads coupled to the isolation structure(s) between opposite sides of the package and electrically coupled to the first circuit, third and fourth leads coupled to the isolation structure(s) between the opposite sides of the package and electrically coupled to the second circuit, a first terminal over the first side of the package between the first lead and the third lead, a second terminal over the second side of the package between the second lead and the fourth lead, and an electronic component coupled to the package and electrically coupled to the first terminal, the second terminal, or both the first and second terminals.