Invention Grant
- Patent Title: Mechanisms for forming image sensor device
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Application No.: US15380764Application Date: 2016-12-15
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Publication No.: US10269845B2Publication Date: 2019-04-23
- Inventor: Volume Chien , Yun-Wei Cheng , Shiu-Ko Jangjian , Zhe-Ju Liu , Kuo-Cheng Lee , Chi-Cherng Jeng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/0232 ; H01L31/0216

Abstract:
A method for forming an image sensor device is provided. The method includes forming a photodetector in a semiconductor substrate and forming a shielding layer over the semiconductor substrate. The method also includes forming a dielectric layer over the shielding layer and partially removing the dielectric layer to form a recess. The method further includes partially removing the shielding layer through the recess. In addition, the method includes forming a filter in the recess after the shielding layer is partially removed.
Public/Granted literature
- US20170098675A1 MECHANISMS FOR FORMING IMAGE SENSOR DEVICE Public/Granted day:2017-04-06
Information query
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