A bonding, communication and control BCC system that, via multiple digital and analog inputs and outputs provided by an on-the-go ready (OTG) microcontroller and a microcontroller combination, is capable of integrating the function of components required for a device to perform its tasks. Each BCC unit has the minimum amount of built in hardware required. First the BCC units bond, using multiple modes of identification and recognition technology. Second, the BCC units interconnect and exchange data via encrypted communication. Third, plug and play hardware can be added to the BCC unit. Each BCC unit can pair with a smart device, making possible full utilization of all of the hardware, software and existing infrastructure of the smart device, including its ability to send data to and from a remote server location.