发明授权
- 专利标题： Method for producing glass substrate with through glass vias and glass substrate
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申请号： US15516266申请日： 2015-09-29
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公开(公告)号： US10276368B2公开(公告)日： 2019-04-30
- 发明人: Keiji Tsunetomo , Hideki Hashizume , Kazuya Ohkawa
- 申请人： Nippon Sheet Glass Company, Limited
- 申请人地址： JP Tokyo
- 专利权人： NIPPON SHEET GLASS COMPANY, LIMITED
- 当前专利权人： NIPPON SHEET GLASS COMPANY, LIMITED
- 当前专利权人地址： JP Tokyo
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP2014-204957 20141003
- 国际申请： PCT/JP2015/004952 WO 20150929
- 国际公布： WO2016/051781 WO 20160407
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/768 ; H01L23/15 ; C03C15/00 ; H01L23/498 ; B23K26/00 ; C03C17/30 ; H01L21/48 ; H05K1/03 ; H05K3/00 ; B23K26/0622 ; B23K26/352 ; B23K26/50 ; H05K1/14 ; B23K103/00 ; B23K101/40
摘要：
A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.
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