Invention Grant
- Patent Title: Substrate support assembly with non-uniform gas flow clearance
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Application No.: US15082015Application Date: 2016-03-28
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Publication No.: US10280510B2Publication Date: 2019-05-07
- Inventor: Shinichi Kurita , Robin L. Tiner
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/458 ; C23C16/50 ; H01J37/32 ; H01L21/687

Abstract:
The embodiments described herein generally relate to a substrate support assembly for use in a plasma processing chamber to provide non-uniform gas flow flowing between the substrate support assembly and sidewalls of the plasma processing chamber. In one embodiment, a substrate support assembly includes a substrate support assembly including a substrate support body defining at least a first side of the substrate support body, and a corner region and a center region formed in the first side of the substrate support body, wherein the corner region has a corner width that is smaller than a center width of the center region, the widths defined between a center axis and the first side of the substrate support body.
Public/Granted literature
- US20170275759A1 SUBSTRATE SUPPORT ASSEMBLY WITH NON-UNIFORM GAS FLOW CLEARANCE Public/Granted day:2017-09-28
Information query
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