公开(公告)号：US12136538B2

公开(公告)日：2024-11-05

申请号：US17505194

申请日：2021-10-19

Applicant: Applied Materials, Inc.

Inventor： Changling Li ,  Lai Zhao ,  Gaku Furuta ,  Soo Young Choi ,  Robin L. Tiner ,  David Atchley ,  Ganesh Babu Chandrasekaran

IPC: H01J37/32 ,  B23B35/00 ,  C23C16/455 ,  C23C16/50

Abstract: A diffuser includes a front-side gradient surface formed from a diffuser block, a back-side gradient surface formed from the diffuser block, and opening structures formed from the front-side gradient surface to the back-side gradient surface. Each opening structure includes a conical opening having a first end along the front-side gradient surface and a second end corresponding to an apex at a depth within the diffuser block, and a cylindrical opening formed from the depth to the back-side gradient surface. The opening structures are arranged in rows including a first set of rows and a second set of rows alternately positioned along a length of the diffuser block.

公开(公告)号：US20220228616A1

公开(公告)日：2022-07-21

申请号：US17229998

申请日：2021-04-14

Applicant: Applied Materials, Inc.

Inventor： Hassan Yousefi ,  Ganesh Babu Chandrasekaran ,  Robin L. Tiner ,  Jianhua Zhou ,  Isami Iguchi

IPC: F16B19/02 ,  F16B5/02

Abstract: A mask frame support unit includes a case, a protruding body extending below the case, and a station having a flat head disposed above the case. The protruding body includes a tapered region and a cylindrical region. The tapered region includes a first end having a first diameter coupled to the case and comprising a second end having a second diameter opposite the first end. The second diameter is less than the first diameter, and the tapered region is coupled to the cylindrical region at the second end. The case houses a number of components including an upper receiving plate in contact with the station, a lower receiving plate disposed underneath the upper receiving plate, a flat head unit movement support mechanism disposed between the lower receiving plate and the body, and a centering component.

公开(公告)号：US10468221B2

公开(公告)日：2019-11-05

申请号：US16122003

申请日：2018-09-05

Applicant: Applied Materials, Inc.

Inventor： Gaku Furuta ,  Soo Young Choi ,  Yi Cui ,  Robin L. Tiner ,  Jinhyun Cho ,  Jiarui Wang ,  Suhail Anwar

IPC: C23C16/00 ,  H01J29/07 ,  C23C16/458 ,  C23C16/04 ,  H01J37/32

Abstract: Embodiments of the present disclosure generally relates a shadow frame including two opposing major side frame members adjacent to two opposing minor side frame members coupled together with a corner bracket, wherein the corner bracket includes a corner inlay having legs that extend in directions generally orthogonal to each other.

公开(公告)号：US10697063B2

公开(公告)日：2020-06-30

申请号：US14610489

申请日：2015-01-30

Applicant: Applied Materials, Inc.

Inventor： Lai Zhao ,  Gaku Furuta ,  Qunhua Wang ,  Robin L. Tiner ,  Beom Soo Park ,  Soo Young Choi ,  Sanjay D. Yadav

IPC: C23C16/00 ,  C23C16/455 ,  H01J37/32 ,  C23C16/458

Abstract: The present disclosure relates to a corner spoiler designed to decrease high deposition rates on corner regions of substrates by changing the gas flow. In one embodiment, a corner spoiler for a processing chamber includes an L-shaped body fabricated from a dielectric material, wherein the L-shaped body is configured to change plasma distribution at a corner of a substrate in the processing chamber. The L-shaped body includes a first and second leg, wherein the first and second legs meet at an inside corner of the L-shaped body. The length of the first or second leg is twice the distance defined between the first or second leg and the inside corner. In another embodiment, a shadow frame for a depositing chamber includes a rectangular shaped body having a rectangular opening therethrough, and one or more corner spoilers coupled to the rectangular shaped body at corners of the rectangular shaped body.

公开(公告)号：US10373809B2

公开(公告)日：2019-08-06

申请号：US15274608

申请日：2016-09-23

Applicant: Applied Materials, Inc.

Inventor： Shinichi Kurita ,  Robin L. Tiner

IPC: C23C16/00 ,  C23F1/00 ,  H01L21/306 ,  H01J37/32 ,  C23C16/458 ,  C23C16/505

Abstract: Implementations described herein generally relate to components and methods used in plasma processing, and more specifically relate to grooved surfaces for controlling RF return path lengths in plasma processing chambers and methods for forming the same. In one implementation, a backing plate for a plasma processing chamber is provided. The backing plate comprises a rectangular body. The rectangular body has a front surface, a back surface opposing the front surface, a first axis perpendicular to a center of the rectangular body and a plurality of grooves formed in the front surface. At least one groove of the plurality of grooves has a first length across the groove in a first location and a second length across the groove in a second location.

公开(公告)号：US10087524B2

公开(公告)日：2018-10-02

申请号：US14275835

申请日：2014-05-12

Applicant: Applied Materials, Inc.

Inventor： Robin L. Tiner ,  Soo Young Choi ,  Qunhua Wang ,  Jrjyan Jerry Chen

IPC: B05B1/00 ,  C23C16/455 ,  H01J37/32

Abstract: Embodiments of the present invention generally provide apparatus and methods for supporting a gas distribution showerhead in a processing chamber. In one embodiment, a gas distribution showerhead for a vacuum chamber is provided. The gas distribution showerhead comprises a body having a first side and a second side opposite the first side, and a plurality of gas passages formed through the body, the gas passages comprising a first bore formed in the first side that is fluidly coupled to a second bore formed in the second side by a restricting orifice, and a suspension feature formed in the first bore of at least one of the gas passages.

公开(公告)号：US09677177B2

公开(公告)日：2017-06-13

申请号：US14505355

申请日：2014-10-02

Applicant: Applied Materials, Inc.

Inventor： Robin L. Tiner ,  Soo Young Choi ,  Beom Soo Park ,  Shinichi Kurita ,  Bora Oh ,  Gaku Furuta

IPC: H05B3/68 ,  C23C16/458 ,  H01L21/67 ,  H05B3/22

CPC classification number: H05B3/22 ,  C23C16/458 ,  C23C16/4586 ,  C23C16/50 ,  H01L21/67103 ,  H05B2203/003

Abstract: The present invention generally relates to a substrate support for use in a processing chamber. The substrate support is divided into quadrants with each quadrant capable of heating independent of the other quadrants. The independent heating permits the substrate support to provide different heating to either different substrate simultaneously disposed on the substrate support or to different areas of a common substrate. Thus, the substrate heating may be tailored to ensure desired processing of the substrate or substrates occurs.

公开(公告)号：US10927461B2

公开(公告)日：2021-02-23

申请号：US16119505

申请日：2018-08-31

Applicant: Applied Materials, Inc.

Inventor： Allen K. Lau ,  Robin L. Tiner ,  Lai Zhao ,  Soo Young Choi

IPC: C23C16/455

Abstract: Embodiments of the present disclosure generally provide apparatus and methods for gas diffuser support structure for a vacuum chamber. The gas diffuser support structure comprises a backing plate having a central bore formed therethrough, an integrated cross structure formed in the central bore, and a gas deflector coupled to the cross structure by a single fastener.

公开(公告)号：US10883174B2

公开(公告)日：2021-01-05

申请号：US16201755

申请日：2018-11-27

Applicant: Applied Materials, Inc.

Inventor： Allen K. Lau ,  Hsiang An ,  Lai Zhao ,  Jianhua Zhou ,  Robin L. Tiner

IPC: C23C16/455 ,  C23C16/50 ,  H01J37/32

Abstract: Embodiments of the present disclosure generally provide apparatus and methods for a gas diffuser assembly for a vacuum chamber, the gas diffuser assembly comprising a mounting plate, the mounting plate comprising a hub, a plurality of curved spokes extending from the hub in a radial direction, a gusset portion coupled between the hub and each of the curved spokes, each of the gusset portions having a convex curve disposed in an axial direction, and one or more mounting holes coupled to the curved spokes.

公开(公告)号：US10312058B2

公开(公告)日：2019-06-04

申请号：US15719465

申请日：2017-09-28

Applicant: Applied Materials, Inc.

Inventor： Soo Young Choi ,  John M. White ,  Qunhua Wang ,  Li Hou ,  Ki Woon Kim ,  Shinichi Kurita ,  Tae Kyung Won ,  Suhail Anwar ,  Beom Soo Park ,  Robin L. Tiner

IPC: H01J37/32 ,  C23C16/34 ,  C23C16/455 ,  C23C16/509

Abstract: Embodiments of a method of depositing a thin film on a substrate is provided that includes placing a substrate on a substrate support that is mounted in a processing region of a processing chamber, flowing a process fluid through a plurality of gas passages in a diffuser plate toward the substrate supported on the substrate support, wherein the diffuser plate has an upstream side and a downstream side and the downstream side has a substantially concave curvature, and each of the gas passages are formed between the upstream side and the downstream side, and creating a plasma between the downstream side of the diffuser plate and the substrate support.