Invention Grant
- Patent Title: Probe card having replaceable probe module and assembling method and probe module replacing method of the same
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Application No.: US15488181Application Date: 2017-04-14
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Publication No.: US10281488B2Publication Date: 2019-05-07
- Inventor: Shih-Shin Chen , Cheng-En Wu , Chia-Hsiang Yu
- Applicant: MPI CORPORATION
- Applicant Address: TW Chu-Pei, Hsinchu Shien
- Assignee: MPI CORPORATION
- Current Assignee: MPI CORPORATION
- Current Assignee Address: TW Chu-Pei, Hsinchu Shien
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW105113147A 20160427
- Main IPC: G01R22/00
- IPC: G01R22/00 ; G01R1/04 ; G01R1/067 ; G01R1/073 ; H01L21/00 ; G01R1/00

Abstract:
A probe card includes a substrate module having an installation hole and a first stair-shaped structure provided on two stairs thereof with a first connection surface and a first transmission surface having a first contact pad, a probe module having a probe and a second stair-shaped structure provided on two stairs thereof with a second connection surface and a second transmission surface having a second contact pad electrically connected with the probe, and a pressing member. The probe module is disposed in the installation hole so that the first and second connection surfaces are connected and the first and second transmission surfaces are opposite. The pressing member is detachably pressed on the probe module to press the second connection surface against the first connection surface and make the first and second contact pads electrically connected.
Public/Granted literature
Information query