- 专利标题: Fluxing underfill compositions
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申请号: US15899878申请日: 2018-02-20
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公开(公告)号: US10283378B2公开(公告)日: 2019-05-07
- 发明人: Hong Jiang
- 申请人: Henkel IP & Holding GmbH
- 申请人地址: DE Duesseldorf
- 专利权人: Henkel IP & Holding GmbH
- 当前专利权人: Henkel IP & Holding GmbH
- 当前专利权人地址: DE Duesseldorf
- 代理商 Steven C. Bauman
- 主分类号: H01L23/28
- IPC分类号: H01L23/28 ; H01L21/56 ; C08G59/02 ; C08G59/18 ; C09D163/00 ; C08L63/00 ; H01L23/29 ; H01L21/48 ; C08G59/50 ; C08K5/09 ; C08K3/013 ; C08G59/20 ; C08G59/24 ; C08G59/42 ; C08G59/40
摘要:
This invention relates to thermosetting resin compositions useful for fluxing underfill applications, particularly in the form of a preapplied film.
公开/授权文献
- US20180350631A1 FLUXING UNDERFILL COMPOSITIONS 公开/授权日:2018-12-06