Invention Grant
- Patent Title: Method to fabricate chip-scale electronic photonic (plasmonic)-integrated circuits
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Application No.: US15736941Application Date: 2016-07-06
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Publication No.: US10288804B2Publication Date: 2019-05-14
- Inventor: Jiming Bao , Zhuan Zhu , Zhiming Wang
- Applicant: University of Houston System
- Applicant Address: US TX Houston
- Assignee: UNIVERSITY OF HOUSTON SYSTEM
- Current Assignee: UNIVERSITY OF HOUSTON SYSTEM
- Current Assignee Address: US TX Houston
- Agency: Winstead PC
- International Application: PCT/US2016/041129 WO 20160706
- International Announcement: WO2017/007816 WO 20170112
- Main IPC: G02B6/122
- IPC: G02B6/122 ; C01B19/00 ; C01G39/06 ; C01G41/00 ; G02B6/10 ; G02B6/30 ; H01L31/0224 ; H01L33/38

Abstract:
Electronic-photonic integrated circuits (EPICs), such a monolithically integrated circuit, are considered to be next generation technology that takes advantage of high-speed optical communication and nanoscale electronics. Atomically thin transition metal dichalcogenides (TMDs) may serve as a perfect platform to realize EPIC. The generation and detection of light by a monolayer TMD at nanoscale through surface plasmon polaritons (SPPs) may be utilized to provide optical communication. The bidirectional nature of the TMDs allow such a layer to be utilizes as part of emitters or photodetectors for EPICs.
Public/Granted literature
- US20180172908A1 A METHOD TO FABRICATE CHIP-SCALE ELECTRONIC PHOTONIC (PLASMONIC) - INTEGRATED CIRCUITS Public/Granted day:2018-06-21
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