Invention Grant
- Patent Title: Wafer processing apparatus, recording medium and wafer conveying method
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Application No.: US15461950Application Date: 2017-03-17
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Publication No.: US10290523B2Publication Date: 2019-05-14
- Inventor: Toshihisa Nozawa
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Studebaker & Brackett PC
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/68 ; G05B19/418

Abstract:
A wafer processing apparatus includes a controller connected to a first robot and a second robot. The controller controls the first robot so that the wafer is placed on a first load lock stage in such a way that the center of the wafer is shifted from the center of the first load lock stage by a first position shift amount and another wafer is placed on a second load lock stage in such a way that the center of the wafer is shifted from the center of the second load lock stage by a second position shift amount. The controller controls the second robot so that the second robot simultaneously conveys two wafers between the first and second load lock stages, and a first processing stage and a second processing stage.
Public/Granted literature
- US20180269088A1 WAFER PROCESSING APPARATUS, RECORDING MEDIUM AND WAFER CONVEYING METHOD Public/Granted day:2018-09-20
Information query
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