Invention Grant
- Patent Title: Integrated circuit structure, gate all-around integrated circuit structure and methods of forming same
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Application No.: US15695229Application Date: 2017-09-05
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Publication No.: US10290549B2Publication Date: 2019-05-14
- Inventor: Ruilong Xie , Julien Frougier , Min Gyu Sung , Edward Joseph Nowak , Nigel G. Cave , Lars Liebmann , Daniel Chanemougame , Andreas Knorr
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/786 ; H01L29/66 ; H01L27/11

Abstract:
The disclosure is directed to gate all-around integrated circuit structures, finFETs having a dielectric isolation, and methods of forming the same. The gate all-around integrated circuit structure may include a first insulator region within a substrate; a pair of remnant liner stubs disposed within the first insulator region; a second insulator region laterally adjacent to the first insulator region within the substrate; a pair of fins over the first insulator region, each fin in the pair of fins including an inner sidewall facing the inner sidewall of an adjacent fin in the pair of fins and an outer sidewall opposite the inner sidewall; and a gate structure substantially surrounding an axial portion of the pair of fins and at least partially disposed over the first and second insulator regions, wherein each remnant liner stub is substantially aligned with the inner sidewall of a respective fin of the pair of fins.
Public/Granted literature
- US20190074224A1 INTEGRATED CIRCUIT STRUCTURE, GATE ALL-AROUND INTEGRATED CIRCUIT STRUCTURE AND METHODS OF FORMING SAME Public/Granted day:2019-03-07
Information query
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