Invention Grant
- Patent Title: Constrained cure component attach process for improved IC package warpage control
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Application No.: US15721707Application Date: 2017-09-29
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Publication No.: US10290569B2Publication Date: 2019-05-14
- Inventor: Kyle Yazzie , Venkata Suresh R. Guthikonda , Patrick Nardi , Santosh Sankarasubramanian , Kevin Y. Lin , Leigh M. Tribolet , John L. Harper , Pramod Malatkar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal LLP.
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L23/498 ; H01L23/367 ; H01L21/50 ; H05K1/02 ; H01L23/00 ; H01L23/52
Abstract:
An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.
Public/Granted literature
- US20190103345A1 CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE WARPAGE CONTROL Public/Granted day:2019-04-04
Information query
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