Invention Grant
- Patent Title: Multiple bond via arrays of different wire heights on a same substrate
-
Application No.: US16008531Application Date: 2018-06-14
-
Publication No.: US10290613B2Publication Date: 2019-05-14
- Inventor: Cyprian Emeka Uzoh , Rajesh Katkar
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: B81B7/00
- IPC: B81B7/00 ; H01L21/48 ; H01L23/00 ; H01L23/42 ; H01L23/48 ; H01L25/00 ; H01L25/16 ; H01L49/02 ; H01L23/367 ; H01L23/498 ; H01L23/522 ; H01L23/538 ; H01L25/065

Abstract:
Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.
Public/Granted literature
- US20180301436A1 Multiple bond via arrays of different wire heights on a same substrate Public/Granted day:2018-10-18
Information query